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DIFFUSALOY 202

Versatile silver alloy for joining copper and copper-base alloys in tight-fit applications

PRODUCT DESCRIPTION:

• Low-melting, self-fluxing silver alloy
• Ideal for joining copper and copper-base alloys
• Thin-flowing for close-fit joints
• Suitable for precision copper assemblies

Applications

STANDARD:

ASME SEC-II PART C, AWS-SFA-5.8, BCuP-6

ALLOYING ELEMENTS:

Ag, P, Cu

BONDING TEMPERATURE:

660°C

Product Specification

• Clean, ductile joints
• Excellent capillary action
• Low working temperature
• Reliable in electrical applications

• Silver matrix alloy
• Trace phosphorus
• Copper alloy base
• Low zinc content

• Clean/degrease joints thoroughly
• Use neutral oxy-acetylene flame
• Apply alloy at dull-red heat
• Use flux for copper alloys
• Wash flux residue in warm water

• Copper radiator tubes
• Electrical contacts
• Commutator joints
• Fuel & lube lines