
DIFFUSALOY 202
Versatile silver alloy for joining copper and copper-base alloys in tight-fit applications
PRODUCT DESCRIPTION:
• Low-melting, self-fluxing silver alloy
• Ideal for joining copper and copper-base alloys
• Thin-flowing for close-fit joints
• Suitable for precision copper assemblies
Applications
STANDARD:
ASME SEC-II PART C, AWS-SFA-5.8, BCuP-6
ALLOYING ELEMENTS:
Ag, P, Cu
BONDING TEMPERATURE:
660°C
Product Specification
• Clean, ductile joints
• Excellent capillary action
• Low working temperature
• Reliable in electrical applications
• Silver matrix alloy
• Trace phosphorus
• Copper alloy base
• Low zinc content
• Clean/degrease joints thoroughly
• Use neutral oxy-acetylene flame
• Apply alloy at dull-red heat
• Use flux for copper alloys
• Wash flux residue in warm water
• Copper radiator tubes
• Electrical contacts
• Commutator joints
• Fuel & lube lines
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